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8 Intel
®
855GME and Intel
®
852GME Thermal Design Guide for Embedded Applications
Mechanical Reference
Mechanical Reference 2
The Intel
®
855GME and Intel 852GME chipset MCHs are constructed with a Flip Chip Ball Grid
Array (FCBGA) package with a size of 37.5 mm x 37.5 mm. It includes 732 solder ball lands with
a ball pitch of 1.27 mm. The chipset MCH will also include capacitors mounted on the top of the
package. Reference drawings are shown in Figure 1 and Figure 2. The drawings are not drawn to
scale and the units shown are in millimeters.
The 855GME and 852GME MCH packages will include capacitors on the top-side. The location of
capacitors may differ between the 855GME and 852GME MCHs. Care should be taken when
applying a thermal solution onto the die in order to avoid any accidental electrical shorts.
2.1 Intel
®
855GME and Intel
®
852GME Chipset MCH
Package
Note: The capacitor locations shown below may not be representative of the exact placement on the
855GME or the 852GME MCH.
Figure 1. 855GME and 852GME chipset MCH Package Dimensions (mm) – Top View
?
37.5
10.3
7.6
0.81
1.60
37.5
Top View
Die
Substrate
Capacitor
?
37.5
10.3
7.6
0.81
1.60
37.5
Top View
Die
Substrate
Capacitor