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20 Intel
®
855GME and Intel
®
852GME Thermal Design Guide for Embedded Applications
Reference Thermal Solution for CompactPCI* and Blade Applications
Reference Thermal Solution for
CompactPCI* and Blade Applications 5
5.1 Applications
The thermal solution referenced in this chapter is valid for both the 855GME and 852GME chipset
MCHs when the application only allows for 0.54” of z-height above the board. Note that many
boundary conditions may permit the 855GME MCH to be packaged without a thermal solution.
The 852GME will require a heatsink in most configurations. See Chapter 3 for computational fluid
dynamics (CFD) modeling where specific boundary conditions are analyzed.
5.2 CompactPCI* Heatsink Thermal Performance
The CompactPCI reference thermal solution is capable of adequately cooling the 855GME or
852GME chipset MCHs at most boundary conditions referenced in Section 3.4.
Figure 13 below shows the thermal performance of the heatsink on both the 855GME and
852GME MCHs at a local ambient temperature (T
LA
) of 55 °C. For performance at other local
ambient temperatures, shift the curve vertically upwards or downwards accordingly. Note that at
T
LA
=60°C with 50 LFM of airflow, this heatsink may not adequately cool the 852GME. For these
applications, Intel recommends the use of the 1U thermal solution presented in Chapter 4.