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Intel
®
855GME and Intel
®
852GME Thermal Design Guide for Embedded Applications 35
Summary
Summary 9
The Intel
®
855GME and Intel
®
852GME Chipset Memory Controller Hub (MCH) Thermal Design
Guide For Embedded Applications was developed to aid in creating adequate thermal designs that
will insure reliable and efficient operation of the 855GME and 852GME chipset MCHs in
embedded applications. The goal of this document is to provide an understanding of the operating
limits of the chipset MCH in embedded environments and to recommend proper thermal design
techniques based on a particular configuration.
Computational Fluid Dynamics (CFD) analysis proved to be a useful tool in providing an initial
basis to determine the thermal limits of the chipset MCH under varying cooling configurations.
Developing a CFD analysis early in the design stage is highly recommended to assist in identifying
potential thermal issues at the individual component and system levels.
Several new features and tools will be made available with the 855GME and 852GME chipset
MCH. The chipset MCH will have an on die temperature sensor to assist the thermal control and
validation of the thermal solution. It will also have the capability to respond to an input from an
external temperature sensor that is placed next the DDR DIMMs. This will allow for improved
thermal control of memory temperatures. New software tools will also be provided to validate the
thermal solution design at TDP levels and to determine read/write throttle settings.