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Intel
®
855GME and Intel
®
852GME Thermal Design Guide for Embedded Applications 11
Computational Fluid Dynamics (CFD) Modeling
3.2 Thermal Design Power (TDP) Values
Use the following thermal design power (TDP) values when modeling based on the configuration
that is being simulated. When designing for intermediate configurations on the 855GME MCH,
round up to next highest TDP value.
3.3 Maximum Temperature Specification
Use the following table to determine the maximum junction temperature value when modeling the
855GME or 852GME chipset MCH. The junction temperature is located at the hottest part of the
die.
3.4 Modeling Assumptions
Computational Fluid Dynamics (CFD) modeling is performed to provide a basis for estimating the
behavior of the Intel
®
855GME and Intel
®
852GME chipset MCHs under varying cooling
configurations. Intel provides a Flotherm model of the 855GM and is available through field
sales. This model may also be used to simulate the 855GME and 852GME chipset MCHs. The
thermal model of the Intel
®
855GME and Intel
®
852GME chipset MCHs were analyzed in a
simulated CompactPCI* blade environment. Assumptions used in the thermal analyses are
summarized below. However, please note that they do not represent a specific design
recommendation and are mainly used as a basis for the thermal analysis.
The following analysis was performed to evaluate the need for a heatsink to adequately cool the
855GME and 852GME chipset MCHs.
Thermal Modeling Assumptions
:
1. Local Ambient Conditions between 40º C and 60º C. Local ambient is specified as the
temperature locally surrounding the processor. Most local ambient conditions for embedded
applications fall near the middle of that range.
2. Airflow ranges between 50 and 500 LFM.
3. The entire motherboard is modeled as an orthotropic cuboid with an effective thermal
conductivity based on the assumed copper content of the motherboard. In the analysis
Table 2. 855GME and 852GME MCH Thermal Design Power
SKU Config
Core
VCC (V)
GFX
Core
(MHz)
DDR
(MHz)
Memory
Size
(Mbytes)
# of
DIMMs
# of
Rows
LVDS
Display
Settings
TDP
(W)
Intel
®
855GME
MCH
Max 1.35 250 333 512 2 4 Dual 4.3
Min 1.2 133 200 256 1 1 Single 2.6
Intel® 852GME
MCH
Max 1.5 266 333 512 2 4 Dual 5.7
Table 3. 855GME and 852GME Chipset MCHs Maximum Temperature Value
Tj,max (°C)
110