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36 Intel
®
855GME and Intel
®
852GME Thermal Design Guide for Embedded Applications
Vendor Information
Vendor Information A
Table 6. 1U Reference Design Heatsink Assembly Suppliers (as referenced in Section 4)
Part
Intel Part
Number
Supplier
Supplier Part
Number
Extruded
Heatsink
Pin Fin Heatsink A54515-001 Foxconn*
Interface
Materials
Chomerics Phase Change
TIM (T-710)
Chomerics* 69-12-22066-T710
Mechanical Interface Material
(Poron)
A61203-001 Boyd*
Attach
Hardware
Clip Frame A65066-001 Foxconn
Clip Lever A67031-001 Foxconn
Solder-Down Anchor (4
required per heatsink)
A13494-005 Foxconn HB96030-DW
Entire
Enabling
Assembly
MCH Enabling Assembly
Includes:
Pin fin heatsink, thermal
interface material, mechanical
interface material, clip frame,
and clip lever (does not
include solder-down anchors)
A67625-001 Foxconn PHC029C02012
NOTE: The above reference heatsink vendors and information are identical to that of the Intel
®
845G MCH.
Table 7. CompactPCI* Reference Design Heatsink Assembly Suppliers (as referenced in
Section 5)
Part
Intel Part
Number
Supplier
Supplier Part
Number
Entire Extruded
Heatsink Enabling
Assembly
Pin Fin Heatsink with
attached Chomerics T411
Adhesive Tape Thermal
Interface Material and Pull-
Tab
N/A Foxconn 2ZG85-001A
Heatsink Only Pin Fin Heatsink N/A Foxconn 071-0000-884-1
Thermal Interface
Material Only
Chomerics Adhesive Tape
TIM (T411)
N/A Chomerics