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10 Intel
®
855GME and Intel
®
852GME Thermal Design Guide for Embedded Applications
Computational Fluid Dynamics (CFD) Modeling
Computational Fluid Dynamics (CFD)
Modeling 3
3.1 855GM MCH Thermal Model
A Computational Fluid Dynamics (CFD) thermal model of the 855GM chipset MCH has been
developed to assist in the characterization of the package thermal limits and the evaluation of
cooling methods. The thermal model used in our analysis is based on the package construction
shown in Figure 3. Simplified cuboids with the correct material properties are used to model the
primary portions of the chipset MCH package as shown in Figure 4. Contact your Intel
representative for information on obtaining the CFD model.
Note: The CFD thermal model for the 855GM MCH may also be used for the 855GME and the 852GME
chipset MCHs.
Figure 3. Package Construction Overview
Figure 4. 855GM MCH Thermal Model
Underfill
C4 bumps
Die
Solder balls
Substrate
Package Overview
Package Overview
Underfill
C4 bumps
Die
Solder balls
Substrate
Package Overview
Package Overview
B1998-01
Die
Solder Balls
Substrate
C4
855GM Thermal Model