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855GME and Intel
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852GME Thermal Design Guide for Embedded Applications 21
Reference Thermal Solution for CompactPCI* and Blade Applications
5.3 Required Volumetric Keepout
The CompactPCI* thermal solution will require a volumetric keepout region above the chipset
MCH. See Figure 14 for a detailed side and top view of the keepout.
There is not a board keep-out restriction for the CompactPCI* heatsink. It uses an adhesive tape
thermal interface material for mechanical retention, and is smaller in footprint than the 855GME
and the 852GME chipset MCHs.
Figure 13. CompactPCI* Heatsink Thermal Performance
855GME/852GME Tcase vs. Airflow for CompactPCI Heatsink
at Temperature (local ambient) = 55 deg C
60
70
80
90
100
110
120
50 100 150 200 250 300 350 400 450 500
Airflow (LFM)
Tcase Temperature (deg C)
Tcase for
855GME
(4.3W)
Tcase for
852GME
(5.7W)
Tcase max = 105 deg C