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24 Intel
®
855GME and Intel
®
852GME Thermal Design Guide for Embedded Applications
Reference Thermal Solution for CompactPCI* and Blade Applications
For more information on force required and other important documentation, see the Chomerics
website at http://www.chomerics.com.
5.7 CompactPCI* Thermal Solution Mechanical
Drawings
See Appendix B, “Mechanical Drawings” for a detailed drawing.
For an official electronic copy, contact Foxconn*. Contact information is available in Appendix A,
“Vendor Information”.