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26 Intel
®
855GME and Intel
®
852GME Thermal Design Guide for Embedded Applications
Temperature Measurement Metrology
6.3 Maximum Temperature Specification
Use Table 4 to determine the maximum temperature value when performing thermal laboratory
testing with the 855GME or 852GME chipset MCH using the metrology described in this chapter
and the TDP Stress Application. More information about the TDP stress application may be found
in Section 7.
Figure 16. 0 Degree Angle Attach Heatsink Modifications (not to scale
Figure 17. 0 Degree Angle Attach Methodology (not to scale)
Table 4. 855GME and 852GME chipset MCH Maximum Case Temperature Value
Tcase,max (°C)
105