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855GME and Intel
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852GME Thermal Design Guide for Embedded Applications 13
Computational Fluid Dynamics (CFD) Modeling
3.6 Modeling Results – 852GME
All boundary conditions evaluated will necessitate a heatsink for the 852GME chipset MCH. See
Figure 6 for a graph of junction temperature (Tj) vs. airflow for various local ambient temperature
conditions. A heatsink will be needed in all cases where the Tj of the 852GME chipset MCH die
is greater than 110 °C. Notice that a heatsink is necessary for all cases shown below.
3.7 CFD Modeling Conclusions
The 855GME chipset MCH, under many embedded configurations, will not require a heatsink.
However, if your boundary conditions are not sufficient to adequately cool the chipset MCH, Intel
offers two reference heatsink designs which are found in sections 4 and 5.
The 852GME chipset MCH will require a heatsink under almost all configurations. Refer to
sections 4 and 5 for a reference thermal solution developed by Intel. Both solutions will work with
the 852GME.
Figure 6. 852GME Airflow Modeling Results
852GME (5.7W) Junction Temperatures vs. Airflow
at Various Local Ambient Temperatures
100
110
120
130
140
150
160
50 100 150 200 250 300 350 400 450 500
Airflow (LFM)
Tj (deg C)
40 C
45 C
50 C
55 C
60 C
T
j max = 110
°C
Heatsink
Required