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Intel
®
855GME and Intel
®
852GME Thermal Design Guide for Embedded Applications 27
Thermal Management Features and Tools
Thermal Management Features and
Tools 7
7.1 Internal Temperature Sensor
The Intel
855GME and 852GME chipset MCH will include an on die temperature sensor that can
be used to protect the chipset MCH from exceeding the Tj,max specification. Upon detection that
the sensor has reached Tj,max the chipset MCH will be capable of initiating a bandwidth throttling
event that will reduce chipset MCH power and temperature. The sensor will also prove to be useful
in optimizing the thermal design for the chipset MCH by being able to provide junction
temperature during testing and evaluation of the thermal solution.
7.2 External Temperature Sensor
The chipset MCH is designed to accept an input signal from an external temperature sensor. The
external sensor can be placed in a location close to the DDR memory and upon detecting a “hot”
condition the chipset MCH would throttle the READ bandwidth. Proper placement of the sensor
would have to be determined by the OEM. The OEM would have to characterize the temperature
difference between the sensor and the DDR memory devices to determine the best placement for
the sensor. On detection of a “hot” condition a signal is communicated directly from the thermal
sensor to the MCH via the ETS# pin as shown in Figure 18. The external thermal sensor can be
programmed via the SMBus.
Figure 18. External Temperature Sensor
MCH-M
ICH
CPU
SMBus
SO-DIMM’s
TS TS
ETS#ETS#
THERM#
SMBdata
SMBclock
Thermal Sensor on
motherboard. OEM
design dependent