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Contents
Contents
1 Introduction....................................................................................................................................6
1.1 Document Objective .............................................................................................................6
1.2 Terminology ..........................................................................................................................6
1.3 Reference Documents ..........................................................................................................7
2 Mechanical Reference...................................................................................................................8
2.1 Intel® 855GME and Intel® 852GME Chipset MCH Package ...............................................8
3 Computational Fluid Dynamics (CFD) Modeling ......................................................................10
3.1 855GM MCH Thermal Model..............................................................................................10
3.2 Thermal Design Power (TDP) Values.................................................................................11
3.3 Maximum Temperature Specification .................................................................................11
3.4 Modeling Assumptions........................................................................................................11
3.5 Modeling Results – 855GME MCH.....................................................................................12
3.6 Modeling Results – 852GME ..............................................................................................13
3.7 CFD Modeling Conclusions ................................................................................................13
4 Reference Thermal Solution for 1U Applications.....................................................................14
4.1 Applications ........................................................................................................................14
4.2 Required Volumetric Keepout.............................................................................................14
4.3 Heatsink Assembly .............................................................................................................16
4.4 Mechanical Retention .........................................................................................................17
4.5 Thermal Interface Material (TIM) and Thermal Bond Line..................................................18
4.6 Solder Joint Protection........................................................................................................18
4.7 1U Reference Thermal Solution Mechanical Drawings ......................................................19
5 Reference Thermal Solution for CompactPCI* and Blade Applications.................................20
5.1 Applications ........................................................................................................................20
5.2 CompactPCI* Heatsink Thermal Performance ...................................................................20
5.3 Required Volumetric Keepout.............................................................................................21
5.4 CompactPCI* Heatsink Assembly ......................................................................................22
5.5 Mechanical Retention .........................................................................................................23
5.6 Thermal Interface Material (TIM) and Thermal Bond Line..................................................23
5.7 CompactPCI* Thermal Solution Mechanical Drawings.......................................................24
6 Temperature Measurement Metrology ......................................................................................25
6.1 Case Temperature Measurements .....................................................................................25
6.2 0 Degree Angle Attach Methodology ..................................................................................25
6.3 Maximum Temperature Specification .................................................................................26
7 Thermal Management Features and Tools................................................................................27
7.1 Internal Temperature Sensor..............................................................................................27
7.2 External Temperature Sensor.............................................................................................27
7.3 TDP chipset MCH Stress Application .................................................................................28
7.4 Memory Thermal Management Software ...........................................................................28
7.5 Thermal Throttling...............................................................................................................29
7.5.1 Bandwidth Triggered Throttling..............................................................................29