3301770
Airflow Consideration
Although the embedded board can operate without active cooling, it is still necessary to install the
board in a chassis with ventilation holes on the sides allowing airflow to travel through the heatsink
surface. In a system with an individual power supply unit, the cooling fan of a power supply can
also help generate airflow through the board surface.
Unpacking Precautions
Some components on the 3301770 are very sensitive to static electric charges and can be
damaged by a sudden rush of power. To protect it from unintended damage, be sure to follow
these precautions:
z
Ground yourself to remove any static charge before touching your PCB. You can do
so by using a grounded wrist strap at all times or by frequently touching any
conducting materials that is connected to the ground.
z
Handle your PCB by its edges. Do not touch IC chips, leads or circuitry if not
necessary.
z
Do not plug or unplug any connector or jumper while the power is on.
z
Do not place a PCB on top of an anti-static bag. Only the inside of the bag is safe
from static discharge.
Approved Memory Modules
(144pin SODIMM modules)
1). 128MB SDRAM (PC-100) UG NEC (D45128163G5-A80-9JF)
2). 256MB SDRAM (PC-100) Transcend SAMSUNG (K4S280832A-TC1H)
3). 64MB SDRAM (PC-133) UG HYUNDAI (HY57V651620B)
4). 128MB SDRAM (PC-133) NEC (D45128841G5-A75-9JF)
5). 256MB SDRAM (PC-133) UG SAMSUNG (K4S560832B-TC75))
6). 512MB SDRAM (PC-133) UG (V54C3256804VBSG)
7). 512MB SDRAM (PC-133) Apacer V54C3256804AB7
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