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SERVICE MANUAL
SY
011470
19991101-168000
1.58K-3711 Printed in Japan ’99.11
HAMAMATSU, JAPAN
CONTENTS
SPECIFICATIONS ................................................... 3
PANEL LAYOUT .................................... 4
CIRCUIT BOARD LAYOUT ................. 5
BLOCK DIAGRAM
............................ 6
WIRING ..................................................................... 7
DISASSEMBLY PROCEDURE .............................. 8
LSI PIN DESCRIPTION .............................. 10
IC BLOCK DIAGRAM ................................. 14
CIRCUIT BOARDS ...................................... 16
TEST PROGRAM ............................ 21/31
MIDI DATA FORMAT ............... 40
MIDI INPLEMENTATION CHART.......................................... 44
PARTS LIST
OVERALL CIRCUIT DIAGRAM